CMP Systems

CMP (chemical mechanical polishing) systems are offered in 1-, 2- and 4-stations systems.
A special bearing system is used to keep the polishing plate with the polishing pad non bowed.

The construction is a heavy build quality to avoid vibrations and deformations.

With this system all kind of materials can be polished to epitaxial quality.

Oxide materials (like Sapphire) can be polished up to 6” and a roughness of 0,5 lattice
constant or better (for Sapphire e.g. 0,21 nm (ra) on a 10 x 10 µm AFM scan).

We offer also the needed technology for several materials to polish and also the needed carriers and tools
Gluing Gluing Gluing