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Moreover we supply special chemicals in highest purity for material sciences and production.

A new activity is the laboratory measurement service to qualify materials and check material qualities.

In all of these fields of activity we offer consulting and advise.

Our task is to work on the high end front of material production and research.

 
CMP Polishing
CMP Polishing
CNC Grinding System 2
CNC Grinding System 2
 
CZ Puller 1
CZ Puller 1
Diamond Dicing Saw Type 2
Diamond Dicing Saw Type 2
 
DIamond Polishing Systems
Diamond Polishing Systems
Diamond Wire Slicing Saw
Diamond Wire Slicing Saw
 
Diamond Wire Slicing System Type 4
Diamond Wire Slicing System Type 4
Dicing Saw Type 3
Dicing Saw Type 3
 
Grinding Station
Grinding Station
Cristal-Growth-Hall
Cristal-Growth-Hall
 
KY Puller 1
KY Puller 1
Mechanical Polishing Stations and Wire Saw Type 3
Mechanical Polishing Stations and Wire Saw Type 3
 
Wafer Cleaning Station
Wafer Cleaning Station
Well Wire Slicing Saw for single cuts
Well Wire Slicing Saw for single cuts
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SurfaceNet GmbH | Oskar-Schindler-Ring 7 | 48432 Rheine | Germany
Phone: +49 (0) 5971 4010179
E-Mail: sales@surfacenet.de
© SurfaceNet GmbH